The Global Radiation Hardened Electronics (RHE) market size was USD 1.48 billion in 2021 and is expected to register a revenue CAGR of 3.9% during the forecast period, according to the latest analysis by Emergen Research. Rising demand for low-cost nanosatellites and communication satellites and increasing intelligence, surveillance, and reconnaissance operations due to growing hostility among nations are factors driving market revenue growth between 2022 and 2030. Currently, increasing number of commercial space operations have led to growing demand for radiation-hardened power management systems. In addition, rapid integration of advanced technologies for electronics in spacecraft and rising usage of low-cost nanosatellites are expected to increase demand for radiation hardening electronics in space programs. According to reports, around 64 countries have already launched their nanosatellites or CubeSats and by 2019 there were around 1,186 nanosatellites launched, which have increased in number in recent times. Moreover, increasing need for nanosatellite power conditioning procedures and usage of radiation-resistant materials are key factors expected to drive market growth. Furthermore, increasing implementation of microelectronics systems and post-irradiation examination for radiation hardening of electronics are other factors driving revenue growth of the market.
Some niche products and services believed to be revenue generators are also included in the report. Apart from this, a wide range of products from various segments and sub-segments expected to present greater opportunities in the Radiation Hardened Electronics industry are discussed in the document. Development of new products and substitutes that will completely transform the market dynamics over the forecast period occupies a special section in the report.
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Key Players operating in the industry are:
BAE Systems, Honeywell International Inc., Renesas Electronics Corporation, STMicroelectronics, Infineon Technologies AG, Microchip Technology Inc., IBM, Data Device Corporation, Cobham Limited, and Micropac Industries, Inc
Radical Features of the Radiation Hardened Electronics Market Report:
- The report encompasses Radiation Hardened Electronics market overview along with market share, demand and supply ratio, production and consumption patterns, supply chain analysis, and other ley elements
- An in-depth analysis of the different approaches and procedures undertaken by the key players to conduct business efficiently
- Offers insights into production and manufacturing value, products and services offered in the market, and fruitful information about investment strategies
- Supply chain analysis along with technological advancements offered in the report
- The report covers extensive analysis of the trends, drivers, restraints, limitations, threats, and growth opportunities in the Radiation Hardened Electronics industry
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Global Radiation Hardened Electronics Market Segmentation based on Product Types and Application Spectrum:
Product Type Outlook (Revenue, USD Million; 2019–2030)
- Custom Made
- Commercial-Off-The-Shelf (COTS)
Material Type Outlook (Revenue, USD Million; 2019–2030)
- Silicon
- Silicon Carbide
- Gallium Nitride
- Others
Manufacturing Technique Outlook (Revenue, USD Million; 2019–2030)
- Radiation-Hardening-By-Design (RHBD)
- Radiation-Hardening-By-Process (RHBP)
- Radiation-Hardening-By-Software (RHBS)
Regional Analysis Covers:
- North America (U.S., Canada)
- Europe (U.K., Italy, Germany, France, Rest of EU)
- Asia Pacific (India, Japan, China, South Korea, Australia, Rest of APAC)
- Latin America (Chile, Brazil, Argentina, Rest of Latin America)
- Middle East Africa (Saudi Arabia, U.A.E., South Africa, Rest of MEA)
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